Quality Standards |
| UL Marking:Company
trademark followed
by PWB type designation |
S1, S1A e S130: single
and double side PWB with FR-4 material
S3 e S3A: single side PWB with CEM-1 material
S4 e S130ML: multilayer PWB
S5: single side PWB with FR-2 material
S6, S7 e S8: double side PWB with CEM-3 material
MC1 e MC2: single side PWB with IMS
|
| Warping and Bending |
<1% |
| Copper thickness in through holes |
25 µm |
| Electroplated cooper thickness on the tracks |
> 25 µm |
| Sn/Pb thickness |
2 - 10 µm |
| Ni. thickness on edge connectors |
> 4 µm |
| Au. thickness on edge connectors |
> 8,0 µm |
| Hole position tolerance |
± 0.1 mm |
| Minimum centering position |
0.05 mm |
| Isolation distance |
> 0.15 mm |
| Short circuits and open circuits |
/ |
| Solder mask |
Fotoimageble |
| Solder mask thickness |
> 2 µm on track edge
> 10 µm on track centre |
| Solder mask Centering |
± 0.05 mm |
| Screen Printing Components |
in yellow, withe and black colours |
| Screen Printing Components Centering |
± 0.05 mm |
| Peeable Solder Masck thickness |
> 200 µm |
| Peeable Solder Masck Centering |
± 0.05 mm |
| Minimum diameter plated through hole |
0.30 mm |
| Finishings |
H.A.L.
Ni - Au - Cu - Silver |
