PRODUCT RANGE

Special Applications? Serigroup find your best solutions!

  • IMS & IMB Printed Circuit Boards
  • IMS & IMB Printed Circuit Boards Multilayer
  • High copper thickness Printed Circuit Boards
  • Flex and Rigid-Flex Printed Circuit Boards
  • FR4 Printed Circuit Boards - single side, double side and multilayer
  • Thermal Management Solutions
SeriGroup
Product Range
Each single printed circuit is produced inside the factory and is tested both electrically and visually to ensure perfect functionality and relevance to the highest quality standards.

IMS & IMB Printed Circuit Boards

01.High thermal conductivity
02.CTI value mostly class 0 > 600 V
03.Good mechanical strength
04.Aluminium oxide DBC replacement application
05.100% Hi-Pot tested substrates
IMS & IMB Printed Circuit Boards
IMS & IMB Printed Circuit Boards

IMS (Insulated Metal Substrate) and IMB (Insulated Metal Baseplate) technologies are increasingly used in the production of substrates for Power Electronics thanks to their thermal, electrical and mechanical performances.

Typical IMS and IMB stack-up:
• Top copper - thickness from 35 to 1000 µm
• Insulation layer - Thermal Conductivity up to 12 W/mK, Breakdown Voltage up to 11 kVAC
• Baseplate - aluminum or copper, thickness from 0.5 to 3.0 mm

IMS
High thermal performance PCBs used for discrete component Power Electronics applications and Power Lighting

IMB
Use of IMS in Power Semiconductors Electronics as Aluminium oxide DBC replacement:
• Equal or even lower Thermal Resistance than Aluminium oxide DBC
• Baseplate already integrated (no solder joint between circuit and baseplate)
• Wide copper thickness range availability
• Higher Mechanical strength than Aluminium oxide DBC

IMS & IMB Printed Circuit Boards Multilayer

01.High thermal conductivity
02.Low inductance on high switching applications
03.Good mechanical strength
04.Reduced PCB size
05.100% Hi-Pot tested substrates
IMS & IMB Printed Circuit Boards Multilayer
IMS & IMB Printed Circuit Boards Multilayer

Both IMS (Insulated Metal Substrate) and IMB (Insulated Metal Baseplate) PCBs can be manufactured with more than one layer.

Typical Multilayer IMS and IMB stack-up:
• Multilayer section - Electrical connections by means of blind vias
• Insulation layer - Thermal Conductivity up to 10 W/mK, Breakdown Voltage up to 11 kVAC
• Baseplate - aluminum or copper, thickness from 0.5 to 3.0 mm

High copper thickness Printed Circuit Boards

01.Copper thickness up to 2000 µm
- Single and double side
02.Copper thickness up to 1000 µm
- Multilayer as well
03.Bus Bar replacement applications
04.Both THT and SMT assemblies are possible
High copper thickness Printed Circuit Boards
High copper thickness Printed Circuit Boards

High copper thickness PCBs are used whenever high electric currents - up to some thousands A - are involved.

Main benefits in Bus Bar replacement application:
• High flexibility in design
• Possibility of components soldering
• Cost saving - especially for prototyping and low volumes
• Thin and homogeneous insulation between copper layers - reduced inductance

Flex and Rigid-Flex Printed Circuit Boards

01.High MOT - up to 300 °C
02.Copper thickness up to 210 µm
03.Single Side, Double Side and Multilayer
04.Rigid-Flex PCBs with metal dissipative areas
Flex and Rigid-Flex Printed Circuit Boards
Flex and Rigid-Flex Printed Circuit Boards

Serigroup Flex and Rigid-Flex PCBs production, both “flex to install” and “dynamic flex”, includes different applications such as:
• Power Electronics
• Battery pack connection and monitoring
• Power Lighting
• Connectors

FR4 Printed Circuit Boards - single side, double side and multilayer

01.ML up to 12 layers
02.Line and space down to 75 µm
03.Laser drilling
04.Peelable Solder Mask replacement with laser cut adhesive PI
FR4 Printed Circuit Boards - single side, double side and multilayer
FR4 Printed Circuit Boards - single side, double side and multilayer

Serigroup can offer almost all the types of FR4 PCBs manufactured with cutting-edge technology equipment such as:
• Direct Image Exposing for Dry Film Solder Mask
• Laser Drilling and Cutting
• Camera positioning in Drilling and Milling

Thermal Management Solutions

01.Enhanced FR4 thermal performances
02.Possibility to directly place FR4 PCBs on heat sinks
03.Laser cutting of Thermal Pads and Gap Fillers
Thermal Management Solutions
Thermal Management Solutions

In addition to the above-mentioned PCB types, Serigroup offers some thermal management tools which can be applied on them to enhance their thermal performances.

Such tools are especially effective on standard products like FR4 and they can be divided as follows:
• Soldering resistant, thermally conductive and electrically insulating selective Thermal Interface Material
• Electrically insulating selective “on board heatsink”
• Customized shape laser cut Thermal Pads and Gap Fillers

SERIGROUP

Printed Circuit Board

Printed circuits used in the fields of Intralogistics, Battery Chargers, E-Mobility, Energy Storage, Industrial, Automotive, Power Lighting and many others. Each single printed circuit produced is tested both electrically and visually in order to guarantee perfect functionality and compliance with the IPC A 600 specifications.

Address

VIA DELL'INDUSTRIA N.20 32016 ALPAGO (BL) ITALY

Phone - Fax

Tel. +39 0437 989077 - Fax: +39 0437 989083

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